Abbrevation
ASP-DAC
City
Yokohama
Country
Japan
Deadline Paper
Start Date
End Date
Abstract

<P>ASP&#8211;DAC is the annual International Conference on Design Automation&#046; Asia and South Pacific Region is one of the most active regions of design and fabrication of silicon chips in the world&#046; The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of interchanging ideas and collaboratively discussing the directions of the technologies related to Embedded System Design, System&#8211;on&#8211;a&#8211;Chip, Deep Submicron Technologies and a variety of New Applications&#046; </P> <P><B>Keywords:</B> System Level Design Methodology<BR>System LSI and SoC design methods, System specification, Specification languages, Design languages, Design reuse and IPs, Rapid prototyping, Low power system design, etc&#046; <BR><BR>Embedded and Real&#8211;Time Systems<BR>Co&#8211;simulation, Co&#8211;verification, Compilation techniques, Hardware&#8211;software co&#8211;design, Real&#8211;time OS and middleware, Design languages for embedded systems, etc&#046; <BR><BR>Behavioral/Logic Synthesis and Optimization<BR>Behavioral/RT synthesis, Optimization techniques in logic design, Library mapping, Interaction between logic design and layout, IP&#8211;core design, Sequential and asynchronous logic synthesis, Hardware algorithms, etc&#046; <BR><BR>Validation and Verification for Behavioral/Logic Design<BR>Logic simulation, Simulation engine, Symbolic simulation, Formal verification, Binary decision diagram, Equivalence checking, Transaction&#8211;level/RTL and gatelevel modeling and validation, etc&#046; <BR><BR>Optimization and Verification in Circuit and Chip<BR>Circuit modeling, Circuit simulation, Cell library characterization and generation, Circuit extraction, Verification, Circuit characterization, Clock/Power/Ground distribution, Signal integrity issues, etc&#046; <BR><BR>Performance Driven Physical Design<BR>Physical synthesis, Floor&#8211;planning, Bufier optimization and planning, Wire optimization and planning, Partitioning, Placement, Global/Detail routing, Module generation, New layout algorithms, Interconnect issues, etc&#046; <BR><BR>Test Technology and Design for Testability<BR>Test design, Test pattern generation, BIST, Fault simulation, Fault modeling, Test method for core&#8211;based design, Test issues on IP cores, Memory testing, LSI tester, etc&#046; <BR><BR>Analog and RF Circuit Design<BR>Analog circuit synthesis, Analog layout, Verification, Simulation techniques, Noise analysis, Analog circuit testing, Analog digital mixed design, etc&#046; <BR><BR>Design for Manufacturability (TCAD)<BR>Device modeling, Device simulation, Parameter extraction, Process modeling, Process simulation, Yield optimization, Device testing, etc&#046; <BR><BR>Reconfigurable Systems<BR>Field&#8211;programmable gate array (FPGA) design, FPGA design tools, Novel reconfigurable systems, Mapping techniques for reconfigurable systems, Application of recon figurable systems, etc&#046; <BR><BR>Leading&#8211;Edge Design Experiments<BR>Microprocessors, Digital signal processors, Design for multimedia, SoC, Design for Wireless communication, A/D mixed circuits, Memories, Sensors, MEMS chips, New applications, etc&#046;</P>