SEMICON Singapore stands up as the most significant annual event for the semiconductor assembly industry. We as well as other industry players always use this event to showcase the latest technology in assembly and packaging. It is definitely the event that both exhibitors and visitors worldwide should not miss. <b>Keywords:</b> ADVANCED PACKAGING TECHNOLOGIES<br>Market Forecasts, Roadmaps, Technology Trends and Challenges, Contract Manufacturing Management and Practice, Supply Chain Management and Ensurance.<br>Flip Chip<br>Underfill characteristics – effect on reliability and device performance, UBM – under bump metallization, Wafer Bumping, KGD – known good die of die level testing and reliability, Chip attach methods and impact on reliability, Green Materials, Flip chip QFN packages,<br>Green Materials and Packaging<br>New molding compounds, Process or system changes required to use new materials, Moldability, Reliability performance, Lead–free solders, lead–free plating technology & chemistry, Green substrate technologies<br>Cost – performance trade offs<br>Material availability, Alternatives, Process/equipment changes required, Reliability, Cost impact<br>Low k Dielectric<br>New Packages & Product Developments<br>Wafer level CSP, Ultra–thin BGA’s, Tape BGA’s, Stacked die packaging, Packaging of Optical Devices, MEMs, MOEMS<br>Leading edge assembly technologies<br>Ultra fine pitch bonding<br>Copper Interconnects, 300mm assembly readiness, Reliability / FA / Simulations<br>TEST TECHNOLOGY<br>Advances in Test Tec, Mixed Signal Test Trends, Memory Device Test Trends, Testing System on Chip, Test Time Reduction using new Test Techniques, Third Generation Wireless Device Test Solution, High Speed Communication Device Test Challenges (SONET, SERDES, ADSL, VDSL, Set–Top–Box Device, HDTV), Microwave Device Test Trend for WLAN (802.11a, 802, 11b, 802.11g), GPS, Bluebooth & RFID<br>Challenges of Today′s Production Test (Wafer Test, Final Test, Strip Testing), Computer Integrated Mfg. (CIM), Challenges for Asia Subcon Test House, Current Trend for Higher Pincount, Multisite Probing, Reduction Test Program Development Cycle Time, Microwave Device Wafer Probing /Testing<br>Economics of Test<br>WAFER PROCESSING TECHNOLOGY<br>Device Technology<br>Memory Devices (DRAM, SRAM, Flash), Isolation Technology, Deep Submicron MOS Technology, Device Reliability, FA, Thin Film, RF (microwave device)<br>Process Technology<br>Materials: Silicon, Gases, Chemicals, Resists, Photolithography, Etching, Wafer Cleaning, Multi–level Interconnection: CMP, Dielectric Deposition, Contact & Via, Fill, Integration<br>Emerging Fab Trends and 300mm Wafers, Mini Enviroments,SMIF, CIM, Factory Automation, Process Integration, Fab Design & Construction<br>Environmentally Friendly Wafer Fabrication Processes<br>MEMS, OPTOELCTRONIC AND PHOTONIC PACKAGING TECHNOLOGIES<br>Market Forecasts, Technology Trends and Challenges, Contract Manufacturing Management and Practice.<br>MEMS:MEMS market forecasts, technology trends and challenges. MEMS Interconnect, Wafer bonding technology, Hermetic packaging for MEMS, Material applications, MEMS contract manufacturing., MEMS packaging reliability<br>OPTOELECTRONICS<br>Optoelectronics market forecasts, technology trends and challenges., Infra–red wireless, Infra–red components, Consumer optoelectronics, Flat–panel, Projection and microdisplays, Solid state lighting, OEICs, Lasers, LED, VCSEL, Detectors, Precision die attach, Polymer material applications, Thermal design and management, Reliability and qualification, Solder and lead–free solders technology & chemistry, Process statistic control and manufacturing automation<br>Photonics/Fiber Optics<br>Optical Amplifiers and modulators, Optical transmitter, receiver, and transceiver, and transponder, Packaging for fiber–optic modules, Passive components, Optical Circuits (planar lightwave circuit and waveguide), Waveguide substrate fabrication, Coarse and Dense WDM (CWDM, DWDM), Optical Epoxy (Index matching Epoxy), Optical backplanes, Free space optics and interconnect, Thermal design and management, Reliability and statistics application, Telcordia application and qualification practice, Market Forecasts, Technology Trends and Challenges, Low cost manufacturing, contract manufacturing management and practice.
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SEMICON
City
Singapur
Country
Singapore
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