This Symposium will be a follow–up to the very successful issues held in 1999 and 2000 in PARIS and in 2001 and 2002 in Mandelieu–La Napoule. This series of Symposia is a unique single–meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in–depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. <b>Keywords:</b> Integrated processes (micromachining, micromolding, ...), Microlithography issues unique to MEMS/MOEMS, Manufacturing, Materials, Assembly technologies, Packaging for harsh environments, MOEMS packaging, RF and microwave packaging, Test structures, Devices & components (sensors, actuators...), Dimensional measurements, Physical measurements, Failure analysis, Reliability, Characterization, Process monitoring,<br>Technology CAD in general, Modeling and simulation of fabrication processes, Devices and components (sensors, actuators, ...), MEMS/MOEMS libraries and IP, Signal processing, Integrated CAD tools, Numerical simulation, Yield estimation, Failure mechanisms, Fault modeling, Fault simulation and test pattern generation, Thermal evaluation, Interoperability of CAD/CAE tools, Multidomain simulation, Structured design methodologies, Languages for interchange data among designs and tools
Abbrevation
DTIP
City
Mandelieu
Country
France
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