This Symposium will be a follow–up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu–La Napoule. This series of Symposia is a unique single–meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in–depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. <b>Keywords:</b> Integrated processes (micromachining, micromolding, ...) Microlithography issues unique to MEMS/MOEMS Manufacturing Materials Assembly technologies Packaging for harsh environments MOEMS packaging RF and microwave packaging Test structures Devices & components (sensors, actuators...) Dimensional measurements Physical measurements Failure analysis Reliability Characterization Process monitoring<br>Technology CAD in general Modeling and simulation of fabrication processes Devices and components (sensors, actuators, ...) MEMS/MOEMS libraries and IP Signal processing Integrated CAD tools Numerical simulation Yield estimation Failure mechanisms Fault modeling Fault simulation and test pattern generation Thermal evaluation Interoperability of CAD/CAE tools Multidomain simulation Structured design methodologies Languages for interchange data among designs and tools
Abbrevation
DTIP
City
Montreux
Country
Switzerland
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