HiTEC 2004 continues the tradition of providing the leading biennial conference dedicated to the advancement and dissemination of knowledge of the high temperature electronics industry. Under the organizational sponsorship of the International Microelectronics and Packaging Society, HiTEC 2004 will be the forum for presenting leading high temperature electronics research results and application requirements. It will also be an opportunity to network with colleagues from around the world working to advance high temperature electronics. <b>Keywords:</b> Applications:<br>Geothermal, Oil well logging, Automotive, Military/aerospace, Space<br>Device Technologies:<br>Si, SiC, Diamond, GaN, GaAs, Contacts<br>Dielectrics Passives:<br>Resistors, Inductors, Capacitors, Oscillators<br>Connectors Packaging:<br>Materials, Processing, Solders/Brazes, PC Boards, Wire Bonding, Flip Chip<br>Circuits:<br>Analog, Digital, Power, Wireless<br>Optical MEMS and Sensors:<br>Vibration, Pressure, Seismic<br>Power Sources:<br>Batteries<br>Reliability:<br>Failure mechanisms, Experimental and modeling results
Abbrevation
HITEC
City
Santa FeNM
Country
United States
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