The IMAPS Technical Committee seeks original papers that demonstrate how new technologies and applications are expanding and redefining the international role of microelectronics. <b>Keywords:</b> Advanced Materials & Processes, Advanced Substrate Technology, Area Array Assembly, Automotive Electronics, Chip–Scale Packaging/Flip Chip, High Density Displays, High Density Packaging, Low Cost Packaging Methods, Management & Marketing, Manufacturing Technologies, Medical Electronics, MEMS Packaging and Applications, Modeling & Simulation, Novel Interconnections, Optoelectronics/Photonics, Polymer Materials & Applications, Power Packaging/Thermal Management, Printed Wiring and Flex Boards, Quality & Reliability, RF/Microwave – Wireless, Sensor Packaging & Applications, Space & Military Electronics, Statistical Process Control Methods, Surface Mount Technology, System Level Packaging, Thick & Thin Film Materials
Abbrevation
IMAPS
City
Boston
Country
United States
Deadline Paper
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