THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system′s cost. The high element density of MCMs, the growing power dissipated in a package, etc..., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. <b>Keywords:</b> Thermal and Temperature Sensors,<br>Thermal Simulation,<br>Electro–thermal Simulation,<br>Thermal Modelling and Investigation of Packages,<br>Reliability Issues,<br>High Temperature Electronics,<br>Heat Transfer Education,<br>Flow Visualisation Techniques,<br>Turbulence Modelling in Complex Geometrics,<br>Thermal Characterization,<br>Measurement of Thermal Properties,<br>Acquisition and Analysis of Thermal data,<br>Temperature Mapping,<br>Novel and Advanced Cooling Techniques,<br>Thermal Performance of Interconnects,<br>Heat Transfer Enhancement,<br>Validation of Thermal Software,<br>Coupled (Thermo–mechanical, Thermo– optical, etc.) Effects
Abbrevation
THERMINIC
City
Sophia Antipolis
Country
France
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