This Symposium will be a follow–up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu–La Napoule. This series of Symposia is a unique single–meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in–depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. <b>Keywords:</b> Technology CAD in general<br>Modeling and simulation of fabrication processes<br>Devices and components (sensors, actuators, ...)<br>MEMS/MOEMS libraries and IP<br>Signal processing<br>Integrated CAD tools<br>Numerical simulation<br>Yield estimation<br>Failure mechanisms<br>Fault modeling<br>Fault simulation and test pattern generation<br>Mechanical simulation<br>Thermal evaluation<br>Interoperability of CAD/CAE tools<br>Multiphysics simulation<br>Structured design methodologies<br>Languages for interchange data among designs and tools<br>Model order reduction<br>Integrated processes (micromachining, micromolding, ...)<br>Process integration between MEMS and electronics<br>Microlithography issues unique to MEMS/MOEMS<br>Manufacturing<br>Materials<br>Assembly technologies<br>Packaging for harsh environments<br>MOEMS packaging<br>RF and microwave packaging<br>Test structures<br>Devices & components (sensors, actuators, ...)<br>Dimensional measurements<br>Physical measurements<br>Failure analysis<br>Reliability<br>Characterization<br>Process monitoring<br>Non destructive evaluation
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DTIP
City
Montreux
Country
Switzerland
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