The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. <b>Keywords:</b> Current and future issues related to on–chip interconnections<br>Router friendly models and modeling tools: accuracy & efficiency<br>Modeling and design of high speed digital IO circuits: signal propagation and reception<br>On–chip power delivery and regulation<br>Advances in modeling core switching noise, and design of novel solutions<br>On–chip measurement techniques<br>Package analysis, including numerical methods<br>Electromagnetic analysis tools<br>Advances in transmission–line techniques<br>Power distribution and package resonance<br>Long distance propagation in large switching complexes<br>Switching noise in multi–layered systems<br>Macromodeling techniques<br>Signal integrity in mixed signal integrated circuits<br>Electrical issues in MEMS packaging<br>New and innovative interconnect packaging structures and their electrical performance<br>RF/microwave packaging structures and their electrical performance<br>MMIC modules and high density packaging<br>Experimental characterization techniques<br>EMC/EMI sources & effects<br>Prediction/measurement of radiation from on–chip sources, interconnect structures and packages<br>Electrical design implications for low cost, high volume packaging<br>Packaging concerns for wireless communication: design and modeling<br>Packaging solutions for one chip radios: design and modeling<br>Performance of packaging for automotive radar systems
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EPEP
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Austin
Country
United States
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