The SAFE – Semiconductor Advances for Future Electronics – workshop focuses on the technology and functionality of transistors, sensors and actuators. This year SAFE will be held on November 23–24 in Veldhoven, the Netherlands. The aim of the SAFE workshop is primarily to bring together researchers from universities, institutes and industry, and to serve as a platform for discussion in the fields of IC–technology, –devices and –manufacturing. The informal ambience of the workshop makes it the ideal place for PhD students to take their first steps in presenting their research. At the workshop PhD students and postdocs get the chance to interact and establish contacts with colleagues from Germany, Belgium, Luxembourg, France and the Netherlands. The majority of the submitting authors will present their work by means of a poster and a flash presentation. Some of them will be invited to elaborate on their work in an oral presentation. The former SeSens workshop focused on recent developments of micro–sensors and micro–actuators in the broadest sense and S&A systems in particular. The sensor and actuator fields bridge the gap between the physical and electronic worlds. It is for that reason that the SeSens workshop has been fully integrated into the workshops SAFE and ProRISC since 2003. Former SeSens papers concerning devices, materials and technology will be incorporated into SAFE while papers concerning read–out electronics and systems will be incorporated into ProRISC. The scope of SAFE is since then expanded with semiconductor–based micro sensors, micro actuators, micro–systems, µTAS (Micro Total Analysis Systems) and multi–chip modules. The SAFE workshop is held in combination with the 17th annual ProRISC workshop on ′Circuits, Systems and Signal Processing′ on Nov. 23–24. <b>Keywords:</b> amorphous silicon devices, chemical mechanical polishing, device modeling, dielectrics, emerging technologies, integrated circuit technology, interconnect, MEMS, microcavity lasers, micro–electronics, micro actuators, microsystems, multi–chip modules, noise, memories, novel packaging concepts, optoelectronics integration, packaging, polysilicon devices, process modeling, RF electronic devices, rapid thermal processing, reliability, RF–applications, RF–technology for telecom systems, semiconductor–based micro sensors, SOI, semiconductor devices, SiGe devices, micro total analysis systems, multi–chip modules, solar cells, TFT′s, wafer bonding, CMP, durability, integrated sensors, integrated actuators, smart sensors, micro–electromechanical systems, micro–machining, ìTAS (=Micro Total Analysis Systems), multi–chip sensor modules, modelling, packaging, rapid thermal annealing, reliability, wafer bonding, etc.
Abbrevation
SAFE
City
Koningshof Veldhoven
Country
Netherlands
Deadline Paper
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