The International Solid–State Circuits Conference is the foremost global forum for presentation of advances in solid–state circuits and Systems–on–a–Chip. The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and use to maintain technical currency, and to network with leading experts. <b>Keywords:</b> ANALOG – Analog circuits and subsystems, including baseband amplifiers, dc–dc converters, continuous–time & discrete–time filters, comparators, multipliers, voltage references, power–control circuits, non–linear analog circuits, op–amps, switched–capacitor circuits, synthesizers, and PLLs. DATA CONVERTERS – Nyquist–rate and oversampling A/D and D/A converters, and sample–and–hold circuits. DIGITAL – Design, fabrication, and test of digital VLSI systems; microprocessors, network processors and chipsets; I/O and inter–chip communication; intra–chip communication; reconfigurable logic–array circuits; digital clock–synthesis circuits and architectures; high–performance and lowpower logic–micro–architectures and circuit techniques; high–speed digital circuits; power–reduction and management methods for digital VLSI, and implementation methodologies for digital VLSI. IMAGERS, MEMS, MEDICAL & DISPLAY – Image sensors and companion chips; smart sensors; MEMS for analog and RF; MEMS for sensor–andinstrumentation applications, integrated sensors and transducers; sensor–interface circuits; biosensors; microarrays and lab–on–a–chip; sensors for medical applications; circuitry and MEMS technologies that enable bio–medical and environmental applications; display drivers, controllers, and companion chips; thin–film–transistor interface circuits; organic LED and liquid–crystal–display interface circuits; flat–panel and projection displays; and circuits for print heads. MEMORY – Static, dynamic, non–volatile, and read–only memory; circuit–design techniques, system architectures, I/O interfaces, and array organizations; magnetic and ferro–electric memory designs and architectures; data storage and multi–bit–cell–based memory designs; embedded memory architectures, cache–memory systems, multi–port memory, and CAM designs; emerging memory technologies; nano–crystal, phase–change, and 3D memories; high–speed low–power and low–voltage memory designs; yield–enhancement redundancy and ECC techniques; and memory testing and built–in self–test. RF – Circuits and sub–circuits for RF/IF/baseband, including receiver and transmitter front–end circuits, narrowband RF, ultra–wideband and millimeter–wave circuits (MMDS, 60GHz), IF amplifiers, power amplifiers, RF switches, power detectors, active antennas – including MIMO, modulators, and demodulators. SIGNAL PROCESSING – Digital signal processors; reconfigurable signal–processing circuits; low–power signal–processing circuits; baseband–communication– processing architectures; cryptographic– and security–processing circuits; analog signal–processing circuits; magnetic– and opticalstorage circuits; multimedia processors, image–processing/compression architectures, audio–and–voice– processing/compression architectures, and graphics processors. TECHNOLOGY DIRECTIONS – Advanced circuit technologies and techniques; ultra–low–voltage and sub–threshold logic design; molecular–, organic–, and nano–electronics; flexible substrates and printable electronics; 3D–integration and novel packaging technologies; compound–semiconductor, superconductive, and micro–photonic technologies and circuits; energy sources and energy harvesting; emerging applications such as biomedical and ambient–intelligence; emerging wireless applications and circuits; 3D RF and mixed–signal circuits; RFID; advanced signal–processing and microprocessor architectures; design for manufacturability; analog and optical processors, non–transistor–based analog and digital circuits and their system architectures; advanced memory technologies; spintronics; quantum storage. WIRELESS – Receivers/transmitters/transceivers for wireless systems including (but not limited to) WLAN, WPAN, WMAN, GPS, DVB/DMB, Bluetooth UWB, GSM/EDGE/CDMA/UMTS/3G/4G base stations and handsets, TV/radio/satellite. WIRELINE – Receivers/transmitters/transceivers for wireline systems including (but not limited to) LAN, WAN, FDDI, Ethernet, token–ring, fiber channel, SONET, SDH, PON, ATM, ISDN, xDSL, cable–modem; optical/electrical data links and backplane transceivers, power–line/phone–line home networks, subscriber–line circuits and modems. Wireline transceiver building blocks like AGC, oscillators, line–drivers and hybrids.
Abbrevation
ISSCC
City
San Francisco
Country
United States
Deadline Paper
Start Date
End Date
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