Since 1994, ICEPT has been held in Beijing, Shanghai, and Shenzhen, China, every two years respectively. As the only electronics packaging technology conference organized and supported by Chinese government and relevant authorities and leading industries, ICEPT has attracted many participants from the whole world, covering all the relevant fields of electronic packaging, such as equipments, ICs, packaging, interconnect, Sensor/actuator/MEMS/NEMS, Opto, LEDs, LCDs, substrates, systems, PCBs and assembly. <b>Keywords:</b> – System Packaging & Integration<br>(SiP/SoP/SoC, 3D packaging, integrated systems)<br>– Advanced Packaging<br>(BGA, CSP, MCM, flip chip, WLP, Nano–packaging, Cu–low k packaging, Plastic Packaging)<br>– Design, Modeling & Tools<br>(modeling and simulation, multi–physics and multi–scale modeling, modeling validation, tools)<br>– Materials & Processes<br>(lead–free solders, underfills, adhesives, dielectrics, and embedded passives)<br>– High Density Substrate & PCB<br>(dielectric, microvia, photolithography and laser, HDI, MCM board) – Microjoining & Assembly<br>(bonding, bumping, reflow, soldering)<br>– Surface Mount Technology<br>(screen printing, pick & place, reflow, AOI, novel equipment) – “More than Moore” technologies and products<br>(Sensor/actuator/MEMS/MOMS/NEMS, LCD & Optoelectronics Packaging, RF, Power and HV, Solid state lighting, etc.)<br>– Manufacturing<br>(quality, process control, cost analysis, modeling, testing)<br>– Reliability and qualification<br>(accelerating testing, analysis, simulation & test)<br>– Education and Training<br>(internet based courses, distance learning, training aterials)<br>– Technology roadmaps<br>(R&D strategy and policy, international collaboration)<br>
Abbrevation
ICEPT
City
Shanghai
Country
China
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