International Microsystems, Packaging, Assembly Conference Taiwan, Taipei, Taiwan, China

Abbrevation

IMPACT

Link

http://impact.itri.org.tw/General/

City

Taipei, Taiwan

Country

China

Deadline Paper

2006-05-15

Start Date

2006-10-18

End Date

2006-10-20

Abstract

In line with its very strong IC foundry industry, Taiwan has also developed into a pivotal position in the world’s IC packaging arena. With the number one packaging revenue generated and a promising MEMS industry sprouting, the International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT), organized by the Industrial Technology Research Institute (ITRI), will be held on October 18–20, 2006 in Taiwan. The purpose of the Conference is to bring together scientists and engineers actively engaged in research and development on Microsystems as well as semiconductor packaging and assembly to discuss current progress and emerging technologies in the fields. The conference venue will be the Grand Formosa Regent Taipei, Taiwan. Original and unpublished papers on all aspects on microsystems, packaging, and assembly are solicited. Keywords: 1. Advanced Packaging Technology –– BGA/CSP/Wafer Level Packaging –– Advanced 3D Packaging and SiP –– LCD & Flexible Packaging –– MEMS Packaging 2. Assembly & Manufacturing –– Advanced Substrate/Module Packaging –– Manufacturing Technology –– Quality & Reliability 3. Model, Simulation & Design –– Modeling, Simulation, & Design –– MEMS Design & Modeling 4. Microsystems Integration –– Micro Sensor Device /System –– Micro Actuator Device /System –– Micro Fluidics Device /System –– Monolithic Integration of MEMS Device and Electronics 5. Material, Process & Equipment –– Material & Processing –– MEMS Process –– Equipment & Process