The VLSI Packaging Workshop in Japan has been held every other year since 1992 in the best season of Kyoto, the ancient capital of Japan, and it has become a well–known international workshop for advanced packaging technologies. The committee strongly encourages you to attend this workshop and participate in the discussion, in order to understand the technology trends and find the proper targets for technology/business development. Bring your latest research results and share with the participants who are experts from the industry and the grove of Academe, and discuss with them. Anybody contributing to human progress through electronics is very welcome to this workshop. <b>Keywords:</b> * 3D Packaging & COC (Chip on Chip)<br>* Advanced Fine Pitch Packaging<br>* Assembly and Packaging Challenges for Cu/Low–k Chips<br>* Electrical Performance & Thermal Management<br>* Failure Mechanisms & Reliability Improvement<br>* Green Material<br>* Integrated Passives<br>* Laminated Materials & Processing<br>* Materials for High Speed Application & Wafer Process<br>* MEMS Packaging Technologies<br>* Micro Bumping Technologies<br>* Nano–Technology<br>* Packaging for Automobile<br>* Packaging for Optoelectronics<br>* RF Components & Modules<br>* RFID Tags<br>* System in a Package (SIP)<br>* Wafer Level CSP<br>
Abbrevation
VLSIP
City
Kyoto
Country
Japan
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