SEMI Technology Symposium 2006, Chiba, Japan

Abbrevation

STS

Link

http://wps2a.semi.org/wps/portal/_pagr/114/_pa.114/273?dFormat=application/mswo…

City

Chiba

Country

Japan

Deadline Paper

2006-06-30

Start Date

2006-12-06

End Date

2006-12-08

Abstract

Semiconductor Equipment and Materials International (SEMI) is soliciting papers from authors around the world for the SEMI Technology Symposium 2006. Keywords: < Device Technology > Advanced Logic device Memory Device Sub–Micron CMOS transistor technology Low Power Device SOI Device Analog Device Device Modeling Device Physics < FEOL Process Technology・Material technology> Advanced Gate Insulator Technology Metal Gate Electrode Channel Formation: Epi，SiGe USJ，Flash/Laser Annealing Stress control technology，Strained Si and Device Characteristics Other FEOL topics Manufacturing Science Improvement in efficiency of process Development and Spread of New Technology, and any other activities at Fab – Yield Improvement – Mass Scrap Restraint – WIP Reduction – SCM – Improvement of OEE – Saving Energy – Cut Materials – Zero–emission – e–manufacturing – 300mmPRIME – 450mm manufacturing technology Session/ Lithography Excimer Steppers/Scanners Immersion Lithography Image Evaluation Technology Aberration Overlay Focusing Resolution Enhancement Technology Photoresist Light Source Development NGL–Next Generation Lithography Tool: EB/EUV/NIL etc. Metrology Lithography Simulation Technology Session / DFM & Mask DFM Technology Design and Process Integration OPC, PPC, RET Mask Data Processing ORC, Process Modeling, Mask Printability Simulation PSM and CPL EUV Masks Metrology Defect Inspection/Repair Cleaning/ Pellicle/ Haze Control Quality Assurance Process Control Session/ Multilevel Interconnection Low–k Film Technology Advanced Metallization Technology (Cu, Al, Ag) Advanced CMP Technology Cu Electroplating Atomic Layer Deposition Damascene Technology Interconnect Integration Plug Formation Technology Reliability of Interconnection 3D package Session/ Etching Low–k or Organic Film Etching Damascene Fabrication Etching Process Damage in Damascene Fabrication Resist Remove Technique in Damascene Etching Low–k or Organic Film Etching System STI Etching Gate Shrink Etching Plasma Tolerance of ArF Photoresist Pattern Damage Control Other topics related to Etching Session/ Packaging Technology/Packaging Materials SiP Structure CMOS/CCD Sensor Module Low Cost Flip Chip Technology Passive Components Embedded High Performance Substrate Technology Module Packaging Technology Assembly Technology in Ultra High Speed Environmental Assembly Technology (Lead free, Eco–design) Packaging Pieces & Materials Packaging Process Technology Assembly Equipment Chip Stacking/3D Packaging Packaging System Design TAB/COF Technology Packaging Design & Simulation Wafer Level MEMS Packaging IC Tag Low–k Interconnection Technology Silicon Inter Poser High Thermal Technology EMI LED/LASER Packaging Wireless Interconnect