The RTP Conference Committee and IEEE invite you to submit abstracts for the 14th Annual IEEE International Conference on Advanced Thermal Processing of Semiconductors – RTP2006. This conference will be held at Kyoto Brighton Hotel, Kyoto, Japan on October 10 to 13, 2006. The conference provides an opportunity for members of the RTP community and academia to share their insight and learn more about Advanced Thermal Processing of Semiconductors. The conference brings together process and equipment engineers, managers, researchers and educators involved in Advanced Thermal Processing of Semiconductors. The Conference is accompanied by a one day workshop ″Pattern Effect and its Impact on Advanced Thermal Processing of Semiconductors″ which will be held on October 10, 2006. The committee invites leaders in the semiconductor industry to submit papers based on all aspects of Thermal Processing of Semiconductors. All submissions should include title, authors with affiliations, four keywords, and an abstract not to exceed 300 words. Final papers should include an introduction, design/development and implementation, results, conclusion, acknowledgment, and references. The number of pages is not limited. <b>Keywords:</b> Advanced Dielectric Formation and RTPCVD<br>Diffusion, Dopant Activation and Junction Formation<br>Application of Thermal Processes to Front and Back End Manufacturing<br>RTP and Advanced Furnace Equipment<br>Temperature Measurement and Control<br>Heat Transfer in Microstructures<br>Modeling and Simulation of Thermal Processes<br>Strategies for RTP and Furnace Processing in the Manufacturing Environment<br>
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RTP
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Kyoto
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Japan
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