The general subject of the meeting is the electrical modeling, design, analysis, and characterization of electronic interconnections and packaging structures. <b>Keywords:</b> • Current and future issues related to on–chip interconnections<br>• Router friendly models and modeling tools: accuracy & efficiency<br>• Modeling and design of high speed digital IO circuits: signal propagation and reception<br>• On–chip power delivery and regulation<br>• Advances in modeling core switching noise, and design of novel solutions<br>• On–chip measurement techniques<br>• Package analysis, including numerical methods<br>• Electromagnetic analysis tools<br>• Advances in transmission–line techniques<br>• Power distribution and package resonance<br>• Long distance propagation in large switching complexes<br>• Switching noise in multi–layered systems<br>• Macromodeling techniques<br>• Signal integrity in mixed signal integrated circuits<br>• Electrical issues in MEMS packaging<br>• New and innovative interconnect packaging structures and their electrical performance<br>• RF/microwave packaging structures and their electrical performance<br>• MMIC modules and high density packaging<br>• Experimental characterization techniques<br>• EMC/EMI sources & effects<br>• Prediction/measurement of radiation from on–chip sources, interconnect structures and packages<br>• Electrical design implications for low cost, high volume packaging<br>• Packaging concerns for wireless communication: design and modeling<br>• Packaging solutions for on chip radios: design and modeling<br>• Performance of packaging for automotive radar systems<br>
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EPEP
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City
Scottsdale
Country
United States
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