Continuing innovation and advances have propelled Optical Microlithography into the technological forefront to achieve resolution and process capability for the 45–nm node. The most recent innovations envision the use of immersion imaging, polarization, hyper–NA lenses, and double exposure techniques to extend optical lithography to 32–nm devices and beyond. These techniques are often coupled with very complex optical resolution enhancement technologies that enable resolutions well beyond traditional values. The successful use of optics to provide viable working solutions for these device nodes will require fundamental integration of all aspects of the lithographic process. This conference welcomes abstract submissions covering the areas that are advancing the field of optical nano– and micro– lithography. Submissions are also invited that present novel approaches to optical lithography and the integration of various means and methods to achieve state–of–the–art imaging solutions. <b>Keywords:</b> Pushing the Limits of Optical Lithography<br>multiple exposure and double patterning techniques<br>lithographic applications of image decomposition methods<br>immersion optical microlithography<br>high– and hyper– NA imaging, including process issues for NA > 1.4<br>reticle effects associated with hyper – NA imaging<br>apodization effects<br>implementation and integration of resolution enhancement methods<br>illumination and reticle optimization<br>proximity effect characterization, correction, and control<br>phase–shifting masking, chromeless masking, polarization masking, OPC<br>polarization impact on imaging and means to control polarization.<br>Lithographic Imaging Fundamentals and Process Integration<br>immersion lithography in manufacturing: results and issues<br>simulation of full system and process components<br>calibration techniques for predictive modeling and verification<br>use and implementation of polarization and immersion modeling<br>process integration of resolution enhancement methods<br>image analysis and assessment<br>characterization and minimization of CD variation<br>full image process optimization and integration<br>mask effects on imaging, including 3D mask phenomena, birefringence, and MEEF.<br>Exposure Systems and Subsystems<br>tool control for OPC stability and matching<br>overlay control 10 nm<br>advances in hyper–NA optical design<br>design and materials issues for NA > 1.4<br>integration of polarization in lithographic systems<br>advances in system design and integration<br>novel advances in system self–metrology<br>exposure tool and source developments<br>illumination metrology and control, including polarization<br>evaluation and characterization of lens performance<br>metrology systems for set–up, adjustment, and control<br>system environmental and contamination control.<br>
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OPML
City
San Jose
Country
United States
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