A cohesive design–to–silicon flow is indispensable in maintaining profitability of the semiconductor industry. This conference invites articles that examine novel approaches for design–process integration aiming at fast turn–around, cost–effective, controllable, and high–yielding integrated circuit (IC) creation. Contributions should emphasize fundamentals of technical solutions rather than their commercial embodiments. Submissions in electronic design automation (EDA), design–for manufacturability (DfM), circuit and yield characterization, and other interdisciplinary studies are welcome. Investigations with exclusive lithography focus including resolution enhancement techniques (RETs) such as optical and process correction (OPC) should be directed to the Optical Microlithography Conference in the same Symposium. <b>Keywords:</b> propagation of design intent and communication of manufacturing constraints<br>physical design optimization for advanced or novel patterning<br>manufacturing–model–based physical design<br>RETs application with design knowledge<br>manufacture–friendly designs and practices, especially practical<br>descriptions of production designs<br>cost–performance tradeoffs between design and manufacture<br>performance–power–manufacturability (speed–leakage–RETs) optimization<br>layout optimization for systematic and random yield loss reduction<br>novel statistical design flow<br>design and flow methodologies for productivity improvement<br>optimal insertion of RETs into design–manufacturing flow<br>design–to–process simulation and calibration<br>physical design verification methodologies.<br>
Abbrevation
DMTDPI
City
San Jose
Country
United States
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