3D Architectures for Semiconductor Integration and Packaging, San Francisco, Vereinigte Staaten

3D integration and packaging of semiconductor devices is gaining noticeable momentum within the semiconductor community&#046; Once only a research curiosity, various forms of 3D integration and packaging are now reaching commercialization, and many continued advancements are expected in the near future&#046; 3D architectures have clearly emerged as a serious contender in the challenges of meeting performance, cost, and size demands for semiconductor devices and products through this decade and beyond&#046; Building integrated circuits in 3D can decrease the size of devices while at the same time offering enhanced performance, a feature not lost upon today’s designers dealing with interconnect issues in conventional 2D platforms&#046; 3D architectures also allow the integration of different devices and circuit functions on the same chip—an additional advantage of key importance for the applications of today and tomorrow&#046; The challenges the industry faces with interconnect issues are not easily solved on the current path of industry efforts&#046; 3D architectures offer an alternative solution path to those challenges&#046; <b>Keywords:</b> Emerging 3D Chip Technologies<br>a&#046; Market and technology drivers<br>b&#046; Key players and current status of 3D technology<br>c&#046; Novel interconnect strategies<br>d&#046; Performance benefits<br>e&#046; Government and university initiatives<br>f&#046; Competing solutions<br>2) Applications and Commercialization<br>a&#046; Key enablers to commercialization<br>b&#046; Applications and market opportunities<br>c&#046; Adopters and Advocates<br>d&#046; End users<br>e&#046; Foundry perspectives<br>f&#046; Market projections and analysts<br>3) Design Methodology and Tools<br>a&#046; Products available and planned<br>b&#046; Options<br>c&#046; Modeling and simulation<br>d&#046; Key issues and opportunities for vendors and users<br>4) Manufacturing in 3D<br>a&#046; Yield and reliability<br>b&#046; Test and inspection<br>c&#046; Performance<br>d&#046; Economics<br>e&#046; Thermal issues<br>f&#046; Design methodology and tools<br>g&#046; Equipment and materials<br>