This conference will focus on two main themes in electronics cooling: first and foremost, a heavy emphasis is placed on a discussion of the expected future demands in the next 10–15 years on thermal management systems and the many possible solutions to these increased demands. Second, attention will be focused on the significant recent advances in thermal management and characterization schemes which have occurred since the highly successful initial THERMES conference held in January 2002. Invited talks in selected emerging areas will be complemented with contributed papers. Panel discussions focusing on technology, market trends and identification of research challenges will enable highly interactive discussions. <b>Keywords:</b> Advances in thermal management of:<br>High–performance computing equipment<br>Portable products<br>Power electronics<br>Telecommunications infrastructure<br>Distributed and large–array electronics<br>Avionics and space systems<br>Military electronics<br>Micro thermal systems and MEMS<br>Nanoscale thermal transport and its potential impact<br>Electro–thermal simulations and co–design of electronic devices<br>Solid state cooling<br>Chip–integrated fluidic cooling<br>Energy efficiency and energy recovery<br>Power reduction techniques<br>Advances in thermal modeling of electronic systems<br>Compact modeling methodologies<br>Multi–scale modeling of electronic systems<br>Thermal issues in electronics manufacturing and assembly<br>Thermal management of macroelectronics and data centers
Abbrevation
THERMES
City
Santa FeNM
Country
United States
Deadline Paper
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