hin semiconductor components have been prevalent for a number of years in microelectronics. The best known examples are integrated circuits on chip cards, where the today?s silicon components range in a thickness of 150 ?m. Also power devices with a chip thickness of about 100 ?m constitute an important segment in today s microelectronics market. A further reduction in chip thickness results in several distinct advantages: firstly, it permits the use of very flat packages required for portable electronics equipment (e.g. cell phones); secondly, it improves the performance of these components where electrical current flows to the reverse side of the chip; thirdly, mechanically flexible silicon chips are achieved by thinning wafers to 30 ?m, excellently suited for cost effective assemblies on flexible substrates.<br>Current trends in the development of technologies for very thin semiconductors are targeting on 3D–integrated chip stacks (memory stacks, CSP, MEMS), opto–electronic devices (LED, solar cells) and ultra–thin RFID applications (e.g. paper thin smart labels)<br>Also in 2005, Fraunhofer IZM is delighted to place this workshop at your disposal and we are looking forward to welcome you to our events in November.<br>Flexible Electronic Systems on November 29<br>Already, we avail ourselfs of electronics multifaceted, from control and feedback control systems via information and communication technology to entertainment electronics. Due to the developments in the area of flexible electronic systems and MEMS, daily life applications will even increase at a progressive rate. Just to mention chipcards, provided with a display, a cell phone becoming a multimedia station, and a wristwatch allowing access and surveillance of certain bodyfunctions, such as pulse and bloodpressure. All these examples require high quality and low–cost production.<br>The purpose of this workshop is to provide an insight into latest developments, technologies, materials and processing.<br><b>Keywords:</b> Thin Semiconductor Devices on November 28<br>Topics:<br>Thin Silicon – Thinning techniques<br>MEMS and Sensors<br>Process technology – Equipment<br>Thin Silicon Packaging<br>Flexible Electronic Systems on November 29<br>Topics:<br>Flexible System Integration<br>Production Technologies for Flex<br>Organic Electronics<br>Hetero Integration for Large Areas<br>
Abbrevation
be flexible
City
Munich
Country
Germany
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