The 8th Electronics Packaging Technology Conference, Singapore, Singapur

Abbrevation

EPTC

Link

http://www.eptc-ieee.net/

City

Singapore

Country

Singapore

Deadline Paper

2006-06-30

Start Date

2006-12-06

End Date

2006-12-08

Abstract

The 8th Electronics Packaging Technology Conference (EPTC 2006) is an International event organized by the IEEE Reliability/CPMT/ED Singapore Chapter, sponsored by IEEE CPMT Society with technical sponsorship from IMAPS. EPTC 2006 will feature technical sessions, short courses and exhibition. It aims to provide a good coverage of technological developments in all areas of electronic packaging from design to manufacturing and operation. It is a major forum for the exchange of knowledge and provides opportunities to network and meet leading experts in the field. Since its inauguration in 1997, EPTC has developed into a highly reputed electronics packaging conference in Asia and is well attended by experts in all aspects related to packaging technology from all over the world. The conference program includes full–day short courses which will be conducted by leading experts in the field. Details will be available at a later date. A tabletop exhibition featuring suppliers of materials, equipment, components, software and service providers of the microelectronics and electronic assembly industries will be held during the conference. Keywords: Emerging Packaging Technologies: Wafer level packaging, 3D integration, embedded passives & actives on substrates, high power modules, SiP and other system integration technologies. Interconnection Technologies: Gold and copper wire bonding and flip chip (eutectic/lead–free solders) on standard and copper low k wafers, solder replacement flip chip (ICP, ACP, ACF, NCP), under bump metallurgy, microvia and build–up technologies, fine pitch interconnects, nano interconnects. Manufacturing Technologies: Sustainable manufacturing processes for environmental and cost improvement. Product/material substitution and recycling. Manufacturing best practices, yield improvement, cost and cycle time reduction, statistical process control. Materials & Processes: Advancements in adhesives, encapsulants, underfills, solder alloys, halogen–free materials, dielectrics, ceramics, composites, thin film processes on laminates, nano–materials and processes for packaging. MEMS Packaging: Packaging solutions for inertial MEMS–pressure sensors, actuators, microrelays bio–MEMS, RF MEMS–resonators, switches and optical MEMS–switches, crossconnects. Electrical Modeling & Signal Integrity: Modeling simulation & measurement for coupling, reflection & switching noise, EMI/EMC analysis on package & subsystems, RF modules, time & frequency domain measurements for advanced modules. Thermal Characterization & Cooling Solutions: Modeling & simulation methodology for thermal characterization of advanced packaging, modules & systems. Novel thermal management solutions. Enhanced air & liquid cooling techniques, Hot–spot management. Mechanical Modeling & Structural Integrity: Thermomechanical modeling. Modeling of delamination, moisture diffusion, hygrostress, drop impact, vibration in modules & systems. Measurement of material & interface properties, experimental verification. Optoelectronics: Design and simulation of opto–electronic components and modules, development of Gbps and Tbps opto–electronics, photonic interconnects and backplanes, design and development of optical passive components, photonic crystal based devices, development of process and assembly methods for opto–electronic components. Quality & Reliability: Component, board and system level reliability assessment, failure analysis, interfacial adhesion, accelerated testing and models, component and systems.