SEMI–THERM is an international forum dedicated to the thermal design and characterization of electronic components and systems. The symposium fosters the exchange of knowledge between practitioners and leading experts from industry, as well as the exchange of information on the latest academic and industrial advances in electronics thermal management.<br>In its 23rd year, SEMI–THERM will include Topic Sessions, Invited Speakers, an Evening Tutorial, and a Short Course program to address key issues highlighted by attendees at the last symposium. SEMI–THERM actively solicits student papers and awards travel stipends and reduced conference fees. Technical workshops, tutorials and vendor exhibits –– for which SEMI–THERM is well known –– will enhance the technical program. Those papers deemed to be among the best in the conference will be invited to be published in IEEE Transactions on Components and Packaging Technologies.<br><b>Keywords:</b> • Practical Thermal Solutions for Low–Cost, High–Volume Systems Design<br>• Package Thermal Design and Components for High–Volume Semiconductor Packages<br>• Thermal Solutions for Low–Noise Environments<br>• System–Level and Board–Level Thermal Design<br>• Solutions for Harsh Environments in Commercial, Defense, and Aerospace Systems<br>• Characterization and Standardization of Material Property Measurements<br>• Thermal Integration in the Product Design Process<br>• Characterization and Modeling of Thermo–Mechanical Stress<br>• Characterization and Modeling of Components, Boards and Systems<br>• CFD Analysis of Complex Geometries and Validation<br>• Temperature and Thermal Property Measurement Techniques<br>• Transient Thermal Control Methodologies<br>• Compact Modeling, Model Reduction and Validation<br>• Roadmaps, Specifications and Traditional Cooling Limits<br>
Abbrevation
SEMI-THERM 23
City
San Jose
Country
United States
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