The premier international packaging, components, and microelectronic systems technology conference, the Electronic Components and Technology Conference (ECTC) strives to offer our attendees an outstanding array of packaging technology information. This year′s conference will have 38 technical sessions, 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner with over 70 exhibitors. The 57th ECTC will be held at John Ascuaga’s Nugget, Reno, Nevada, USA from May 29 –June 1, 2007.<br>The Technical Program contains papers covering leading edge developments and technical innovations across the packaging spectrum topics include advanced packaging, modeling & simulation, optoelectronics, interconnections, materials & processing, quality & reliability, manufacturing technology, Components & RF and Emerging Technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded Motorola–IEEE CPMT Society Graduate Student Fellowship, Intel Best Student Paper award, and best and outstanding paper awards.<br>The Professional Development Courses offer state–of–the–art technology reviews and updates in condensed half–day format. Topics cover a wide range of technologies including: 3D packaging, Pb–free solders, RF/Wireless packaging, GHz IC packaging, optoelectronic components and modules, system–on–package, chip scale and wafer scale packaging, integrated passive technology, polymers for electronic packaging, and package reliability. The panel discussion and plenary sessions both offer a format that allows for ample exchange and dialogue between the presenters and audience. They provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.<br>The Technology Corner complements the technical program by providing companies the opportunity to exhibit their products and services in an environment that enables discussion and interaction with the managers and engineers attending ECTC.<br>This year, the ECTC will provide emphasis on three emerging technology areas in biomedical packaging nano–scale technologies and organic device packaging. Biomedical packaging is experiencing increased interest as this devices are shrinking and more point–of–care biochips are being developed with integrated capabilities. After years of laboratory research, promising implementations of nanotechnology are beginning to appear. Packaging and assembly breakthroughs are precursors to the successful use of many nanotechnologies. Organic device technology is developing rapidly, especially for low–cost applications. Atmospheric and moisture sensitivities, however, remain packaging challenges. Organic electronics offers the opportunity to embed active devices with passives, and to merge device and packaging technologies. The 2007 ECTC emerging technologies sessions will provide must–have information on challenges and advances of these areas.<br>The ECTC would not be possible without the sponsorship of the IEEE Components, Packaging, Manufacturing Technology Society and the Electronic Components, Assemblies, and Materials Association (the components sector of the Electronic Industries Alliance), numerous corporate participants and sponsors, and the time and energies of the more than 190 engineers and scientists on the ECTC Executive and Program Committees.<br><b>Keywords:</b>
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ECTC
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Sparks
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United States
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