SMTA International is a world–class conference organized by the SMTA, featuring over 100 technical papers, 26 tutorials and special symposiums on Contract Manufacturing, Staying Competitive and Lead–Free Soldering Technology.<br>Everything you need to keep pace with rapidly changing technology, identifying innovative solutions and maintaining your competitive edge can all be found at the 2007 conference. <b>Keywords:</b> Emerging Technologies<br>0201 components and assembly , ″Getters″ , MEMS / RF MEMS/MOEMS , Nanotechnology , Optoelectronics , System in Package , Nanotechnology , Wireless applications, including Bluetooth and Wi–Fi″<br>Process Control<br>AOI , Computer integrated manufacturing , In–circuit test , Process modeling , Software , Test strategies , X–ray<br>Components<br>3–D/Stacked packaging , Ball grid arrays , Battery interaction , Chip scale packages, including , WL–CSP , Component reliability , Component solderability , Connectors , Direct chip attach (flip chip) , Embedded passives , Failure analysis , Fine pitch technology , Harsh environments (automotive, military, space) , Lead/termination finish , Leadless packaging , MultiChip packages, including 3D packaging , Package on package(POP)<br>Assembly<br>Alternate alloys , Adhesives , BGA/CSP assembly , Cleaning process , Connector technology , Copper erosion , Design for Excellence / Design for Six Sigma , Dispensing process , Equipment selection , Facility layout , Flux and solder , Land pattern design , Lead–free reliability , Lead–free soldering , Lean manufacturing , Low volume / prototype assembly , Medical electronics , Moisture sensitivity , Placement process , Printing process , Solder paste , Reflow soldering , Rework and repair , RFID Assembly , Selective soldering , Set up reduction , Supplier engineering (board assembly) , Wave soldering , Yield improvement<br>Business<br>Capacity modeling , Contract manufacturing , Design for Success – Remaining Competitive , Doing business in China , Environmental issues , Lean manufacturing , Operations management , RoHS compliance , Supplier management , Technology roadmaps , Total quality management<br>PCB Technology<br>Black pad , Embedded passive components (capacitors, resistors, inductors) , HDI , Microvias, filled and unfilled , Soldermask , Substrate reliability , Substrate solderability , Surface finish
Abbrevation
SMTAI
City
Orlando
Country
United States
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