The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders from around the world. <b>Keywords:</b> Business<br>Cross Cultural Management , Economics and Cost Analysis Green Manufacturing (Energy Conservation, Pb– and Halogen–free, etc.) , Manufacturing Management , Outsourcing Strategies , Supplier Chain and Operations Management , Roadmaps<br>Packaging<br>3D and Stacked Packages , Ball Grid Array , Chip Scale , Display Drivers , Embedded Devices , Flip Chip , Integrated Passive Devices (IPDs) , MCM/SiP , RF and Microwave , Thermal Management , Wafer Level Assembly<br>Interconnection<br>Advanced PWBs , Co–Fired Ceramics , Flat Panel Displays , Flex / Flex Rigid , High Density Interconnects , Microvias , Shaped Circuits , Thin and Thick Film Materials<br>Markets<br>Characterizations , Penetration Strategies , Segmentation , Technology Drivers , Trends and Forecasts<br>Assembly<br>Automation Control , Component Placement , Direct Chip Attach , Materials and Processes , Repair and Rework , Test and Troubleshooting<br>Microsystems and Nanotechnology<br>Actuators , DFX , MEMS/MOEMS , Nano Materials , Nano Systems , Optoelectronics , Partitioning Strategies , Sensors
Abbrevation
Pan Pac
City
Maui
Country
United States
Start Date
End Date
Abstract