International Interconnect Technology Conference, Burlingame, Vereinigte Staaten

Abbrevation

IITC

Link

http://www.his.com/~iitc/

City

Burlingame

Country

United States

Deadline Paper

2007-01-19

Start Date

2007-06-04

End Date

2007-06-06

Abstract

The IITC forum provides a unique forum for professionals in the semiconductor industry and academia to present and discuss interconnect–related issues and new technology for the fabrication of advanced interconnects in monolithic ICs, multi–chip modules (MCMs) and state–of–the–art packages. Keywords: Dielectrics: Dielectric materials (low k, high k, ARCs, etc.) and deposition processes (vapor deposition, CVD, spin–on, etc.) for interconnect applications. CMP/Planarization: Dielectric/Metal CMP processes, equipment and metrology issues. Alternative planarization techniques. Metallization: Metal deposition processes/equipment (PVD, CVD, ALD, electroplating) and materials characterization with particular emphasis on advanced aluminum and copper metallization. Process Integration: Multilevel interconnect processes, clustered processes, novel interconnect structures, contact/via integration, metal barrier and materials interface issues, etc. Process Control/Modelling: CMP, metal/dielectric deposition and etching processes, PVD, CVD, electroplating, etc. Reliability: Metal electromigration and stress voiding, dielectric integrity and mechanical stability, thermal effects, passivation issues, interconnect reliability prediction/modeling. Interconnect Systems: Interconnect performance modeling and high frequency characterization, interconnect system integration and advanced packaging concepts (flip–chip, chip–on–chip, MCM, etc.), novel architectures and advanced interconnect concepts (optical, superconductors, etc.). System–on–a–Chip: Interconnect, design and processing of SOC, embedded memory processing, materials and integration, RF and high frequency passive components, noise and cross–talk issues. Dry Processing: Dry etching of vias, trenches and damascene structures, dry etching of metal, dry cleaning processes, plasma induced damage, etc. Alternative Interconnect: Advanced interconnect concepts, optical interconnect, superconductors, nanotechnology–based interconnects, etc.