The Global Semiconductor Forum is the industry’s most prestigious invitation–only interpersonal event. Global Heads of Manufacturing and Operations can meet with equipment, material and service suppliers to define effective and profitable solutions for chip production.<br>While Heads of Design and Technology can meet with major end user organisations to discuss chip solutions for new applications within the microelectronics industry, the focus for 2007 being the 3C’s (Computers, Communications and Consumer Electronics).<br>Delegates from chip manufacturers, fabless companies, OEM’s and end user organisations can evaluate the latest strategic thinking and technological advances that are necessary for profitable, efficient, safe and sustainable activities. Delegates will be able to meet with senior executive’s of leading supplier companies from across the world, whose offering will assist them in implementing future decisions on the procurement of new technologies.<br>This unique event will create and reinforce the strategic alliances that are critical to the success of leading chip manufacturers, fabless companies, OEM’s and end–user organisations.<br>GSF 2007 will take place in Hong Kong over 3 days ensuring that delegates are able to meet, discuss, interact and advance commercial interests.<br>Through a series of pre–planned one to one meetings, a highly interactive seminar and conference programme and numerous networking opportunities, GSF 2007 will provide the ideal environment to advance commercial interests.<br><b>Keywords:</b> With Gigahertz Gone, Watt′s Next?<br>Where is the Foundry Model Headed?<br>Next Generation Materials and Nanotechnology: Advancing Technology<br>Fab and Equipment Productivity<br>Yield Trends and the Impact of DFM<br>Developing Emerging Markets in Asia: Applying the Successful Elements of the Past 50 Years<br>Delivering Successful Multi–Core Processing in Volume Production – Key Process Technology and Design Architect Factors<br>IC Yield Improvement – The Design Contribution in Solving Manufacturing Issues<br>Private Equity and the Semiconductor Industry – Emerging Trends, Opportunities and their Implications for the Industry<br>Computing, Communications & Consumer Electronics and the Challenges in Seamless Operability – How does ″3C Integration″ Effect the Semiconductor Industry?<br>The Transition to 450mm: Is it Cost Effective?<br>
Abbrevation
GSF
City
Hong Kong
Country
China
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End Date
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