Increasing levels of integration and increasing operating frequencies are the dominant trends in RF and microwave IC design. The mobile handset is now much more than just a means for making a phone call and the range of multimedia applications has been made possible, in part, by the increased levels of integration in the RF front–end. The increasing prevalence of Wi–Fi based WLANs has been facilitated by high levels of RF integration, as has the incorporation of Bluertooth wireless connectivity into numerous handheld consumer products.<br>Increased interest in higher operating frequencies is a result of emerging technologies and applications. Examples of emerging technologies include WiMAX and UWB. High frequency applications receiving increased attention include automotive radar, passive imaging and high data–rate wireless transceivers. This move to increased use of higher operating frequencies has led in turn to process development, with SiGe, InGaP HBT, PHEMT and MHEMT processes all allowing high performance IC realisation at frequencies to mm–wave. <b>Keywords:</b> • Highly integrated transceivers • PAs • Frequency sources • Low noise amplifiers and receivers • Phase and amplitude control components • Broadband passive devices • Frequency converters • UWB devices • ICs for RFID applications • mm–wave ICs • SoIC and SiP designs • MCMs • High frequency packaging • Innovations in RFOW test • EM modelling of ICs
Abbrevation
RF and Microwave IC Design
City
Savoy Place, London
Country
UK
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