The Pan Pacific Microelectronics Symposium promotes International technical interchange and provides a premier forum for extensive networking among microelectronics professionals and business leaders throughout the Pacific Basin. Participants come from Australia, China, India, Japan, Korea, North America, Southeast Asia, and Taiwan as well as Europe! <b>Keywords:</b> Business<br>Cross Cultural Management Economics and Cost Analysis Green Manufacturing (Energy Conservation, Pb– and Halogen–free, etc.) Manufacturing Management Outsourcing Strategies Supplier Chain and Operations Management Roadmaps Supply Chain and Operations Management<br>Packaging<br>3D and Stacked Packages Ball Grid Array Chip Scale Display Drivers Embedded Devices Flip Chip Integrated Passive Devices (IPDs) MCM/SiP RF and Microwave Thermal Management Wafer Level Assembly<br>Interconnection<br>Advanced PWBs Co–Fired Ceramics Flat Panel Displays Flex / Flex Rigid High Density Interconnects Microvias Shaped Circuits Thin and Thick Film Materials<br>Markets<br>Characterizations Penetration Strategies Segmentation Technology Drivers Trends and Forecasts<br>Assembly<br>Automation Control Component Placement Direct Chip Attach Materials and Processes Repair and Rework Test and Troubleshooting<br>Microsystems and Nanotechnology<br>Actuators DFX MEMS/MOEMS Nano Materials Nano Systems Optoelectronics Partitioning Strategies Sensors
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Pan Pac
City
Kauai
Country
United States
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