International Conference on Planarization/CMP Technology, Dresden, Deutschland

Abbrevation

ICPM

Link

http://www.icpt2007.com/conferences_en/icpt+2007/

City

Dresden

Country

Germany

Deadline Paper

2007-06-08

Start Date

2007-10-25

End Date

2007-10-27

Abstract

the International Conference on Planarization/CMP Technology ICPT <?xml:namespace prefix = st1 ns = ″urn:schemas–microsoft–com:office:smarttags″ /><st1:chmetcnv w:st=″on″ TCSC=″0″ NumberType=″1″ Negative=″False″ HasSpace=″True″ SourceValue=″2007″ UnitName=″in″>2007 in</st1:chmetcnv> <st1:place w:st=″on″><st1:City w:st=″on″>Dresden</st1:City>, <st1:country–region w:st=″on″>Germany</st1:country–region></st1:place>, is organized by the German CMP User Group within the German VDE/VDI–Society Microelectronics, Micro– and Precision Engineering. The mission of this conference is the provision of a forum for the worldwide CMP community for exchange and discussion on a high scientific level in order to support and advance the developments of this highly important field of semiconductor manufacturing.<?xml:namespace prefix = o ns = ″urn:schemas–microsoft–com:office:office″ /> Keywords: <UL> <LI>Copper/low–k CMP processes and control <LI>CMP process integration issues and reliability <LI>CMP defects <LI>CMP consumables (pads, slurries) <LI>CMP modelling, simulation and theory <LI>Metrology, characterization and test <LI>Advances in ECD/ECP/ECMP processes and tools <LI>CMP in emerging technologies <LI>Dielectric/STi CMP processes and control <LI>Corrosion control during CMP process <LI>Post CMP cleaning <LI>CMP equipment and metrology <LI>Chemical and physical mechanisms of CMP <LI>Advanced CMP process control techniques <LI>Low–shear CMP</LI></UL>