<P style=″MARGIN–TOP: 5px; MARGIN–BOTTOM: 5px″><SPAN lang=EN–US style=″FONT–SIZE: 12pt; FONT–FAMILY: Century Gothic″>Following the traditions set up by its predecessors, MTDT07 will provide a forum dedicated to the recent advancements of the memory technology, covering topics such as memory device, circuit design, architecture, fabrication process, verification, yield analysis testing/diagnosis/repair for all kinds of memory such as SRAM, DRAM, Flash memory, EPROM, EEPROM, embedded memories, 3–D memories, content addressable memories, etc.</SPAN></P> <B>Keywords:</B> Next–generation memory device<BR>Memory testing<BR>Next–generation memory process<BR>Memory built–in self–test<BR>DRAM cell design<BR>Memory diagnosis & repair<BR>Flash cell design<BR>Cell Characterization<BR>Cache memory design<BR>Failure analysis<BR>Multi–port SRAM design<BR>Fault modeling<BR>High–speed memory design<BR>Yield analysis<BR>Low–power memory design<BR>Reliability analysis<BR>Fault–tolerant architecture<BR>Memory for space application<BR>Memory compiler<BR>Verification methodology<BR>
Abbrevation
MTDT
City
Taipei
Country
Taiwan
Deadline Paper
Start Date
End Date
Abstract