The eleventh annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology. The IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology. Now in its second decade, the conference will include new subjects of interest. Contributions from universities, national laboratories, IDMs and equipment and materials suppliers are encouraged. <B>Keywords:</B> <SPAN class=Text><B> <P><B>Materials and Unit Processes</B> <P></P> <P><B>Process Integration:</B> <P></P> <P><B>Process Modeling</B> <P></P> <P><B>Reliability</B> <P></P> <P><B>3D Processes and Integration</B> <P></P> <P><B>Interconnect Systems:</B> <P></P> <P><B>System in a Package</B> <P></P> <P><B>System–on–a–Chip</B> <P></P> <P><B>Novel Materials and Concepts</B> </P></B></SPAN>
Abbrevation
IITC
City
Burlingame
Country
United States
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