<STRONG>Chip, Packaging, Design, Simulation and Test </STRONG><BR><B>Keywords:</B> <TABLE width=538 border=0> <TBODY> <TR> <TD width=254><SPAN>–> Circuit and system design </SPAN></TD> <TD width=274><SPAN>–> Wafer fabrication, automation and reliability</SPAN></TD></TR> <TR> <TD><SPAN>–> Design flow </SPAN></TD> <TD><SPAN>–> Semiconductor materials</SPAN></TD></TR> <TR> <TD><SPAN>–> Simulation and modelling</SPAN></TD> <TD><SPAN>–> Wafer level packaging</SPAN></TD></TR> <TR> <TD><SPAN>–> Measurement equipment and testing </SPAN></TD> <TD><SPAN>–> Clean room equipment and services</SPAN></TD></TR> <TR> <TD><SPAN>–> System packaging </SPAN></TD></TR></TBODY></TABLE>
Abbrevation
SCD
City
Dresden
Country
Germany
Start Date
End Date
Abstract