Designing printed board assemblies is more difficult today than ever before. Printed board designers are faced with the continuing design issues of surface mount vs. through–hole technology, what materials to use, board size and layer count, how to incorporate electrical testing, impedance control requirements, and what new specifications are being invoked on the design process and many other topics. The tolerance characteristics that make sense using the capabilities of today’s manufacturing equipment will also be discussed. Attendees will have a unique opportunity to obtain firsthand information on design issues that affect PCB assembly.<BR> <B>Keywords:</B> <UL> <LI>DESIGN PARAMETERS: Component placement, electrical characteristics, impedance control, printed board classes and tolerances of equipment. <LI>MATERIAL SELECTION: Including a review of standard and special materials, their impact on cost and difficulty in manufacturing. New low dielectric materials will also be discussed. <LI>SMALL HOLE TECHNOLOGY: Discussions on the trade–offs between high–aspect ratio holes, buried vias and blind vias. <LI>IMAGING: The characteristics of line widths and spacings and the relationship between phototooling and CAD data delivered to the board manufacturer. <LI>CONDUCTOR DEFINITION: Including a discussion on both internal and external conductors, a review of etching and plating characteristics and their impact on the end product tolerances, the land patterns used for surface mounting and the characteristics of impedance controlled circuitry. <LI>LAMINATION: Discussions on manufacturing of multilayer boards and relating design concepts to the end product. <LI>SOLDERMASK AND LEGEND: Discussions on the application of soldermask over tin lead and soldermask over bare copper, as well as tolerances and registration of soldermask to the circuit pattern. <LI>FINAL FABRICATION: Tolerances on the board outline and panelization concepts. <LI>QUALITY CONTROL: Discussions on the use of quality conformance coupons to verify design parameters and performance of the end product. <LI>LAND PATTERN REQUIREMENTS: The design requirements for three types of land patterns indicating the process and reliability characteristics <LI>COMPONENT USAGE: Review includes the characteristics of various components all of which are a part of a single electronic product that must consider the assembly process, surface conditions and testing access. <LI>ASSEMBLY PROCESSES: Highlights the various assembly processes and discusses the design impact on each approach related to component arrangement and allowable component clearance. <LI>DATA TRANSFER CONDITIONS: The issue of getting good design data to the manufacturing floor in a timely manner is covered, as well as data archiving principles and web–based data transfer. <LI>ELECTRICAL TESTING: The design impact of built–in probe points and the testability of printed boards for 100% continuity testing (opens and shorts) as well as in circuit and functional testing requirements.<BR></LI></UL>
Abbrevation
IPC Workshop
City
Santa Clara
Country
United States
Start Date
End Date
Abstract