Abbrevation
20. CMP-Nutzertreffen
City
München
Country
Germany
Start Date
End Date
Abstract

<P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt&#8243;><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;&#8243;>Das nationale Treffen am 11&#046; April 2008, zu dem ich hiermit herzlich einladen möchte, wird mal wieder am Fraunhofer Institut für Siliziumtechnologie ISIT in Itzehoe durchgeführt&#046; Es findet in der Zeit von 8:30 – ca&#046; 16:00 im Institutsgebäude des ISIT in der Fraunhoferstr&#046; 1 statt&#046; Wie immer wird es am Vorabend die Möglichkeit für ausgiebige Gespräche im Rahmen eines gemeinsamen Dinner&#8211;Buffets geben&#046;<?xml:namespace prefix = o ns = &#8243;urn:schemas&#8211;microsoft&#8211;com:office:office&#8243; /></SPAN></P> <B>Keywords:</B> <P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt 18pt; TEXT&#8211;INDENT: &#8211;18pt; mso&#8211;list: l2 level1 lfo1; tab&#8211;stops: list 18&#046;0pt&#8243;><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Symbol; mso&#8211;fareast&#8211;font&#8211;family: Symbol; mso&#8211;bidi&#8211;font&#8211;family: Symbol&#8243;><SPAN style=&#8243;mso&#8211;list: Ignore&#8243;>·<SPAN style=&#8243;FONT: 7pt &#8242;Times New Roman&#8242;&#8243;> </SPAN></SPAN></SPAN><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;&#8243;>CMP&#8211;Prozesse<SPAN style=&#8243;mso&#8211;tab&#8211;count: 1&#8243;> </SPAN>STI, Dielektrika, Metalle, poly&#8211;Si, post&#8211;CMP Reinigung</SPAN></P> <P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt 18pt; TEXT&#8211;INDENT: &#8211;18pt; mso&#8211;list: l4 level1 lfo2; tab&#8211;stops: list 18&#046;0pt&#8243;><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Symbol; mso&#8211;fareast&#8211;font&#8211;family: Symbol; mso&#8211;bidi&#8211;font&#8211;family: Symbol&#8243;><SPAN style=&#8243;mso&#8211;list: Ignore&#8243;>·<SPAN style=&#8243;FONT: 7pt &#8242;Times New Roman&#8242;&#8243;> </SPAN></SPAN></SPAN><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;&#8243;>CMP&#8211;Equipment<SPAN style=&#8243;mso&#8211;tab&#8211;count: 1&#8243;> </SPAN>Neue Toolentwicklungen, 300mm, ECMP, Cleaner</SPAN></P> <P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt 18pt; TEXT&#8211;INDENT: &#8211;18pt; mso&#8211;list: l3 level1 lfo3; tab&#8211;stops: list 18&#046;0pt&#8243;><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Symbol; mso&#8211;fareast&#8211;font&#8211;family: Symbol; mso&#8211;bidi&#8211;font&#8211;family: Symbol&#8243;><SPAN style=&#8243;mso&#8211;list: Ignore&#8243;>·<SPAN style=&#8243;FONT: 7pt &#8242;Times New Roman&#8242;&#8243;> </SPAN></SPAN></SPAN><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;&#8243;>CMP Meßtechnik<SPAN style=&#8243;mso&#8211;tab&#8211;count: 1&#8243;> </SPAN>Endpunkterkennung, Prozeßkontrolle (APC)</SPAN></P> <P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt 18pt; TEXT&#8211;INDENT: &#8211;18pt; mso&#8211;list: l0 level1 lfo4; tab&#8211;stops: list 18&#046;0pt&#8243;><SPAN lang=EN&#8211;GB style=&#8243;FONT&#8211;FAMILY: Symbol; mso&#8211;fareast&#8211;font&#8211;family: Symbol; mso&#8211;bidi&#8211;font&#8211;family: Symbol; mso&#8211;ansi&#8211;language: EN&#8211;GB&#8243;><SPAN style=&#8243;mso&#8211;list: Ignore&#8243;>·<SPAN style=&#8243;FONT: 7pt &#8242;Times New Roman&#8242;&#8243;> </SPAN></SPAN></SPAN><SPAN lang=EN&#8211;GB style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;; mso&#8211;ansi&#8211;language: EN&#8211;GB&#8243;>CMP Materialien<SPAN style=&#8243;mso&#8211;tab&#8211;count: 1&#8243;> </SPAN>Pads, Slurries, Fixed Abrasive CMP, Abrasive&#8211;free </SPAN></P> <P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt 86&#046;45pt; TEXT&#8211;INDENT: 86&#046;45pt&#8243;><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;&#8243;>Polishing, Filtration, Abwasserbehandlung, Recycling</SPAN></P> <P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt 18pt; TEXT&#8211;INDENT: &#8211;18pt; mso&#8211;list: l1 level1 lfo5; tab&#8211;stops: list 18&#046;0pt&#8243;><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Symbol; mso&#8211;fareast&#8211;font&#8211;family: Symbol; mso&#8211;bidi&#8211;font&#8211;family: Symbol&#8243;><SPAN style=&#8243;mso&#8211;list: Ignore&#8243;>·<SPAN style=&#8243;FONT: 7pt &#8242;Times New Roman&#8242;&#8243;> </SPAN></SPAN></SPAN><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;&#8243;>weitere CMP&#8211;Themen<SPAN style=&#8243;mso&#8211;tab&#8211;count: 1&#8243;> </SPAN>Modelling, Simulation, Trends, Konferenzen, weitere CMP&#8211;</SPAN></P> <P class=MsoNormal style=&#8243;MARGIN: 0cm 0cm 0pt 172&#046;9pt&#8243;><SPAN lang=DE style=&#8243;FONT&#8211;FAMILY: Arial; mso&#8211;bidi&#8211;font&#8211;family: &#8242;Times New Roman&#8242;&#8243;>Anwendungen (z&#046;B&#046; MEMS, 3D&#8211;Integration, Siliziumwafer und andere Substrate, Optik, Disks)</SPAN></P>