14th International Workshop on Thermal investigations of ICs and Systems, Rom, Italien

Abbrevation

THERMINIC

Link

http://cmp.imag.fr/conferences/therminic2008/

City

Rom

Country

Italy

Deadline Paper

2008-04-30

Start Date

2008-09-24

End Date

2008-09-26

Abstract

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system’s cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. This year THERMINIC will address in addition to the “traditional” thermal management problems, also stress and thermal–stress–related–reliability issues, both in micro– and opto–electronics fields. These issues, including various nanotechnology applications, are of significant importance and of high interest to the engineering community engaged in the field of thermal phenomena in “high–tech” systems. The Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and by CMP. Keywords: – Thermal and Temperature Sensors – Thermal Simulation – Electro–thermal Simulation – Thermal Modelling and Investigation of Packages – Reliability Issues – High Temperature Electronics – Heat Transfer Education – Flow Visualisation Techniques – Turbulence Modelling in Complex Geometrics – Defect and failure modelling – Reliability evolution and prediction – Multiphysics simulation – Nanoengineering issues – Education – Measurement of Thermal Properties – Acquisition and analysis of Thermal data – Temperature Mapping – Novel and Advanced Cooling Techniques – Thermal Performance of Interconnects – Heat Transfer Enhancement – Validation of Thermal Software – Coupled (Thermo–mechanical, Thermo– optical, etc.) Effects – Thermal Stress: Theory and Experiment – Thermal Stress Failures: Prediction and Prevention – Nanotechnology Applications.