This Symposium will be a follow–up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu–La Napoule, in 2004 and 2005 in Montreux, Switzerland and in 2006 in Stresa, Italy. This series of Symposia is a unique single–meeting event expressly planned to bring together participants interested in manufacturing microstructures and participants interested in design tools to facilitate the conception of these microstructures. Again, a special emphasis will be put on the very crucial needs of MEMS/MOEMS in terms of packaging solutions. The goal of the Symposium is to provide a forum for in–depth investigations and interdisciplinary discussions involving design, modeling, testing, micromachining, microfabrication, integration and packaging of structures, devices, and systems. <B>Keywords:</B> •Technology CAD in general<BR>•Modeling and simulation of fabrication processes<BR>•Devices and components (sensors, actuators, …)<BR>•MEMS/MOEMS libraries and IP<BR>•Signal processing<BR>•Integrated CAD tools<BR>•Numerical simulation<BR>•Yield estimation<BR>•Failure mechanisms<BR>•Fault modeling<BR>•Fault simulation and test pattern generation<BR>•Mechanical simulation<BR>•Thermal evaluation<BR>•Interoperability of CAD/CAE tools<BR>•Multiphysics simulation<BR>•Structured design methodologies<BR>•Languages for interchange data among designs and tools<BR>•Model order reduction.<BR>
Abbrevation
DTIP
City
Nice
Country
France
Deadline Paper
Start Date
End Date
Abstract