Abbrevation
ITC
City
Santa Clara
Country
United States
Deadline Paper
Start Date
End Date
Abstract

International Test Conference, the cornerstone of TestWeek(tm), is the world&#8242;s premier conference dedicated to the electronic test of devices, boards and systems&#8211;covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement&#046; At ITC, test and design professionals can confront the challenges the industry faces, and learn how these challenges are being addressed by the combined efforts of academia, design tool and equipment suppliers, designers, and test engineers&#046;<br><b>Conference Focus Topics:</b><br>Adaptive Test<br>BIST or Embedded Test—Chip and Board<br>Bring&#8211;up Test and Silicon Debug<br>Design and Test for Reliability<br>Experiments and Case Studies<br>High&#8211;Speed Digital Test<br>Low&#8211;Cost Test/ATE<br>On&#8211;Chip Test Compression<br>On&#8211;line Test<br>RF Testing<br>Test Data Analysis<br>Test for Nanometer Technologies<br>Test Resource Partitioning<br><b>Hot Topics:</b><br>Board and System Test<br>Defect&#8211;based Testing<br>High&#8211;Speed I/O Test<br>Innovative Industrial Test Practice<br>Power Issues in Test<br>Test and Design for Manufacturability<br>Volume Diagnosis and Yield Learning<br><b>Regular Topics:</b><br>ATE Hardware and Software<br>ATPG, Test Synthesis<br>Boundary&#8211;Scan<br>Design&#8211;for&#8211;Test: Chip, Board and System<br>Economics of Test<br>FPGA Test<br>IDDQ and Current Test<br>Interface Issues<br>Loadboard Design and Simulation<br>MCM and KGD Test<br>Memory Test<br>Microprocessor Test<br>Mixed&#8211;Signal and Analog Test<br>Multisite Test<br>Production Test Automation<br>System&#8211;on&#8211;Chip Test<br>System&#8211;in&#8211;Package Test<br>Test Standards<br>Test Effectiveness<br>Wafer Probe<br>