IEEE 2009 International Interconnect Technology Conference, Royton Sapporo Hotel, Sapporo,, Japan

<p>The twelfth annual IITC is sponsored by the IEEE Electron Devices Society and the Japan Society of Applied Physics as a premier conference for interconnect technology&#046; It IITC provides a forum for professionals and researchers in semiconductor processing, advanced materials, equipment development, and interconnect systems to present and discuss exciting new science and technology&#046;</p> <p>The 2009 Conference will be held at the Royton Sapporo Hotel in Sapporo, Hokkaido, Japan&#046; This will be the first time the conference will be held at an international location&#046;</p> <p>A Short Course addressing advanced interconnect process, design and reliability issues will once again be offered on the day preseding the conference (May 31)&#046; On June 1 and 2, the exhibit hall will feature displays of new products, processes, analytical methods and materials; and the popular Supplier Seminars will be held in the evenings on June 1 and/or 2&#046;</p> <p> The conference is soliciting papers addressing all aspects of interconnect technology&#046; Regular papers, with 3&#8211;page abstracts, will be selected for either oral or poster presentation&#046; The Organizing Committee explicitly requests contributions for new areas: memory, manufacturing, packaging and new materials&#046; In addition to this, papers with 2&#8211;page abstracts will be selected for a special poster session for New Engineers and Students&#046; The deadline for paper submissions is January 19, 2009&#046;</p> <!&#8211;&#8211;end body content&#8211;&#8211;><br>