Abbrevation
COOL CHIPS XII
Link
http://www.coolchips.org/index.html
City
Yokohama Joho Bunka Center
Country
Japan
Deadline Paper
Start Date
End Date
Abstract

<div align=&#8243;justify&#8243;>COOL Chips is an International Symposium initiated in 1998 to present advancement of low&#8211;power and high&#8211;speed chips&#046; The symposium covers leading&#8211;edge technologies in all areas of microprocessors and their applications&#046; The COOL Chips XII is to be held in Yokohama on April 15&#8211;17, 2009, and is targeted at the architecture, design and implementation of chips with special emphasis on the areas listed below&#046; The COOL Chips Organizing Committee will ask the MICRO to publish selected papers in a special issue on COOL Chips XII&#046; </div> <table border=&#8243;0&#8243; cellpadding=&#8243;0&#8243; cellspacing=&#8243;0&#8243; width=&#8243;100%&#8243;> <tbody><tr><td align=&#8243;left&#8243; bgcolor=&#8243;#ffffff&#8243; width=&#8243;100%&#8243;><br><div class=&#8243;style1&#8243; align=&#8243;justify&#8243;> Contributions are solicited in the following areas: </div><br></td></tr> </tbody></table> <table border=&#8243;0&#8243; cellpadding=&#8243;0&#8243; cellspacing=&#8243;0&#8243; width=&#8243;100%&#8243;> <tbody><tr><td align=&#8243;left&#8243; bgcolor=&#8243;#ffffff&#8243; width=&#8243;100%&#8243;> <div class=&#8243;style1&#8243; align=&#8243;justify&#8243;> <ul><li><b>Low Power&#8211;High Performance Processors</b> for Multimedia, Digital Consumer Electronics, Mobile, Graphics, Encryption, Robotics, Networking and Biometrics&#046; </li><li><b>Novel Architectures and Schemes</b> for Single Core, Multi&#8211;Core, Embedded System, Reconfigurable Computing, Grid, Ubiquitous, Dependable Computing and Wireless&#046; </li><li><b>Cool Software</b> including Binary Translations, Compiler Issues and Low Power Techniques&#046; </li></ul> </div> <!&#8211;&#8211;<B><FONT FACE=&#8243;Arial, Helvetica, sans&#8211;serif&#8243; SIZE=&#8243;4&#8243; COLOR=&#8243;#008844&#8243;> <LI><B><I>10th Anniversary Special Topics:</I></B> <UL> <UI>Low Power, High Performance and High Efficiency Supercomputing&#046; </UL> </UL> </td></tr> &#8211;&#8211;> </td></tr></tbody></table> Proposals should consist of a title, an extended abstract (up to 3 pages) describing the product or topic to be presented and the name, job, title, address, phone number, FAX number, and e&#8211;mail address of the presenter&#046; Please prepare an extended abstract using the given guidelines and template<a href=&#8243;http://www&#046;coolchips&#046;org/SubmitFormat&#046;pdf&#8243;&gt;(pdf,</a><a href=&#8243;http://www&#046;coolchips&#046;org/SubmitFormat&#046;doc&#8243;>doc)</a>&#046; The status of the product or topic should precisely be described&#046; If this is not&#8211;yet&#8211;announced product, and you would like to keep the submission confidential, please indicate it&#046; We will do our best to maintain confidentiality&#046; Proposals will be selected by the program committee&#8242;s evaluation of interest to the audience&#046; Submission should be made by e&#8211;mail,<br>to: Makoto Ikeda, Program Chair at <a href=&#8243;mailto:submit_xii@coolchips&#046;org&#8243;>submit_xii&#8243;at&#8243;c…;