Design, Test, Integration & Packaging of MEMS/MOEMS, Seville, Spanien

This Symposium will be a follow&#8211;up to the very successful issues held in 1999 and 2000 in Paris and in 2001, 2002 and 2003 in Mandelieu&#8211;<br>La Napoule, in 2004 and 2005 in Montreux, Switzerland in 2006, in 2007 in Stresa, Italy, in 2008 in Nice, France and in 2009 in Rome,<br>Italy&#046; This series of Symposia is a unique single&#8211;meeting event expressly planned to bring together participants interested in manufacturing<br>microstructures and participants interested in design tools to facilitate the conception of these microstructures&#046; 90 submissions were<br>received from 21 countries&#046; The symposium will be held in Seville, Spain, 5&#8211;7 May 2010, inludes 2 conferences – CAD, design and test /<br>microfabrication, integration and packaging &#8211;, 2 invited talks, 2 special sessions and an exhibition&#046; The symposium is sponsored by the IEEE<br>Components, Packaging, and Manufacturing Technology Society and by CMP&#046;