16th International Workshop on Thermal investigations of ICs and Systems, Barcelona, Spanien

THERMINIC Workshops are a series of events to discuss the essential thermal questions of<br>microelectronic microstructures and electronic parts in general&#046; These questions are becoming<br>more and more crucial with the increasing element density of circuits packaged together and<br>with the move to nanotechnology&#046; These trends are calling for thermal simulation, monitoring<br>and cooling&#046; Thermal management is expected to become an increasingly dominating factor of<br>a system’s cost&#046; The growing power dissipated in a package, the mobile parts of microsystems<br>raise new thermal problems to be solved in the near future necessitating the regular discussion<br>of the experts in these fields&#046; Finally, there is an increasing need for accurate assessment of<br>the boundary conditions used in the analysis of electronic parts, which requires a concurrent<br>solution of the thermal behaviour of the whole system&#046;<br>This year THERMINIC will address in addition to the “traditional” thermal management<br>problems, also stress and thermal&#8211;stress&#8211;related&#8211;reliability issues, both in micro&#8211; and optoelectronics<br>fields&#046; These issues, including various nanotechnology applications, are of<br>significant importance and of high interest to the engineering community engaged in the field<br>of thermal phenomena in “high&#8211;tech” systems&#046;<br>The Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing<br>Technology Society and by CMP&#046;