<span class="Apple–style–span" style="border–collapse: separate; color: rgb(0, 0, 0); font–family: ′Times New Roman′; font–style: normal; font–variant: normal; font–weight: normal; letter–spacing: normal; line–height: normal; orphans: 2; text–indent: 0px; text–transform: none; white–space: normal; widows: 2; word–spacing: 0px; font–size: medium;"><span class="Apple–style–span" style="font–family: ARIAL,HELVETICA,sans–serif; font–size: small;">The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio–medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies. In addition, the European Union’s RoHS directive has now been joined by those of REACH, the dimethyl fumarate ban and the new Canadian Management plan on substances of concern for electrical and electronic equipment complicating matters considerably. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component assembly are among the concerns being addressed. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.<span class="Apple–converted–space"> </span><font size="–2"><br></font>To register for the conference or academy tutorials please click on the "Register Now" button on the right side of the page.</span></span>
Abbrevation
ICSR
City
Hilton Toronto Airport Hotel
Country
Canada
Start Date
End Date
Abstract