IEEE 2011 International Interconnect Technology Conference, Dresden, Deutschland

Abbrevation

IITC

Link

http://www.ieee.org/conference/iitc

City

Dresden

Country

Germany

Deadline Paper

2010-10-31

Start Date

2011-05-08

End Date

2011-05-12

Abstract

<SPAN lang=EN–US style="COLOR: rgb(51,51,51); FONT–FAMILY: ′Arial′,′sans–serif′"> <P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"><FONT color=#000000>The fourteenth annual IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology. Starting with refractory metals and silicides in the 1980s, moving to materials for advanced metallization in 1995, the 2011 MAM conference is the 20<SUP>th</SUP> in a series devoted to materials research, materials properties and interactions. <?xml:namespace prefix = o ns = "urn:schemas–microsoft–com:office:office" /></FONT></SPAN></P> <P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"><FONT color=#000000> </FONT></SPAN></P> <P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"><FONT color=#000000>The topics of this joint conference include both fundamental and applied research, as well as issues related to introduction into manufacturing. Covering the fields of metallization and interconnects, the conference addresses aspects in the fields of â€œMore Mooreâ€ and â€œMore than Mooreâ€.. The Organizing Committee explicitly solicits contributions for the following new areas: Back–End Memories, Power and Automotive Interconnects, Chip–Package Interaction.</FONT></SPAN></P> <P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"><FONT color=#000000> </FONT></SPAN></P> <P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"><FONT color=#000000>The objective of the conference is to provide a forum for open discussions between science and industrial application. It is dedicated to material scientists, process and integration engineers and PhD students active in the areas of semiconductor processing, advanced materials, equipment development, and interconnect systems. Contributions from universities, national laboratories, IDMs, foundries, and equipment and materials suppliers are encouraged.</FONT></SPAN></P> <P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"><FONT color=#000000></FONT></SPAN> </P><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"><FONT color=#000000> <P style="MARGIN: 0cm 0cm 0pt"><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">SUBJECTS OF INTEREST and PRELIMINARY SESSION TITLES:</SPAN></B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"> </SPAN></P> <P style="MARGIN: 0cm 0cm 0pt"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"> </SPAN></P> <P style="MARGIN: 0cm 0cm 0pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Materials and Unit Processes</SPAN></B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"> </SPAN></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Process Integration </SPAN></B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"></SPAN></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol; mso–bidi–font–weight: bold"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Characterization</SPAN></B></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol; mso–bidi–font–weight: bold"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Reliability </SPAN></B></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol; mso–bidi–font–weight: bold"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Chip–Package Interaction (CPI)</SPAN></B></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">3D Integration</SPAN></B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"> </SPAN></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Novel Systems and Packaging</SPAN></B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"> </SPAN></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Novel Materials and Concepts</SPAN></B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US"> </SPAN></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol; mso–bidi–font–weight: bold"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Back–End Memories </SPAN></B></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol; mso–bidi–font–weight: bold"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Silicides and Contacts</SPAN></B></P> <P class=MsoListParagraph style="MARGIN: 0cm 0cm 0pt 36pt; TEXT–INDENT: –18pt; mso–list: l0 level1 lfo1"><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: Symbol; mso–ansi–language: EN–US; mso–fareast–font–family: Symbol; mso–bidi–font–family: Symbol; mso–bidi–font–weight: bold"><SPAN style="mso–list: Ignore">Â·<SPAN style="FONT: 7pt ′Times New Roman′"> </SPAN></SPAN></SPAN><B><SPAN lang=EN–US style="FONT–SIZE: 10pt; FONT–FAMILY: ′Arial′,′sans–serif′; mso–ansi–language: EN–US">Power and Automotive Interconnects</SPAN></B></P> <P class=MsoNormal style="MARGIN: 0cm 0cm 0pt"></FONT></SPAN> </P></SPAN>