17th International Workshop on Thermal investigations of ICs and Systems, Paris, Frankreich

<P>THERMINIC Workshops are a series of events to discuss the essential thermal questions of<BR>microelectronic microstructures and electronic parts in general&#046; These questions are becoming<BR>more and more crucial with the increasing element density of circuits packaged together and<BR>with the move to nanotechnology&#046; These trends are calling for thermal simulation, monitoring<BR>and cooling&#046; Thermal management is expected to become an increasingly dominating factor of<BR>a system’s cost&#046; The growing power dissipated in a package, the mobile parts of microsystems<BR>raise new thermal problems to be solved in the near future necessitating the regular discussion<BR>of the experts in these fields&#046; Finally, there is an increasing need for accurate assessment of<BR>the boundary conditions used in the analysis of electronic parts, which requires a concurrent<BR>solution of the thermal behaviour of the whole system&#046;<BR>This year THERMINIC will address in addition to the “traditional” thermal management<BR>problems, also stress and thermal&#8211;stress&#8211;related&#8211;reliability issues, both in micro&#8211; and optoelectronics<BR>fields&#046; These issues, including various nanotechnology applications, are of<BR>significant importance and of high interest to the engineering community engaged in the field<BR>of thermal phenomena in “high&#8211;tech” systems&#046;<BR>The Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing<BR>Technology Society and by CMP&#046;</P> <P><STRONG><EM>AREAS OF INTEREST</EM></STRONG> include, but are not limited to, the following topics:</P> <P> <TABLE cellSpacing=0 cellPadding=0 border=1> <TBODY> <TR> <TD vAlign=top width=307> <P>Thermal and Temperature Sensors</P></TD> <TD vAlign=top width=307> <P>Measurement of Thermal Properties</P></TD></TR> <TR> <TD vAlign=top width=307> <P>Thermal Simulation</P></TD> <TD vAlign=top width=307> <P>Acquisition and analysis of Thermal data </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Electro&#8211;thermal Simulation</P></TD> <TD vAlign=top width=307> <P>Temperature Mapping</P></TD></TR> <TR> <TD vAlign=top width=300> <P>Thermal Modelling Investigation of Packages</P></TD> <TD vAlign=top width=307> <P>Novel and Advanced Cooling Techniques </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Reliability Issues</P></TD> <TD vAlign=top width=307> <P>Thermal Performance of Interconnects</P></TD></TR> <TR> <TD vAlign=top width=307> <P>High Temperature Electronics</P></TD> <TD vAlign=top width=307> <P>Heat Transfer Enhancement </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Heat Transfer Education</P></TD> <TD vAlign=top width=307> <P>Validation of Thermal Software </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Flow Visualisation Techniques</P></TD> <TD vAlign=top width=307> <P>Coupled Thermo&#8211;mechanical, Thermo&#8211; optical, etc&#046;) Effects </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Turbulence Modelling in Complex Geometrics</P></TD> <TD vAlign=top width=307> <P>Thermal Stress: Theory and Experiment </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Defect and failure modelling</P></TD> <TD vAlign=top width=307> <P>Thermal Stress Failures: Prediction and Prevention </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Reliability evolution and prediction</P></TD> <TD vAlign=top width=307> <P>Nanotechnology Applications </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Multiphysics simulation</P></TD> <TD vAlign=top width=307> <P>Noice control </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Nanoengineering issues</P></TD> <TD vAlign=top width=307> <P>3DIC, power electronics </P></TD></TR> <TR> <TD vAlign=top width=307> <P>Education</P></TD></TR></TBODY></TABLE></P>