<p><font face="Arial, Helvetica, sans–serif" size="–1" color="#000000">The European Advanced Process Control and Manufacturing (APCM) Conference arose from the European AEC/APC Conference. It is focussed on</font> <font face="Arial, Helvetica, sans–serif" size="–1" color="#000000"><strong>Current challenges and future needs of Advanced Process Control and Manufacturing Effectiveness</strong></font><font color="#000000">.<br></font><br></p><p align="justify"><font face="Arial, Helvetica, sans–serif" size="–1" color="#000000"> It is directed to manufacturers, suppliers and scientific community of semiconductor, photovoltaic, LED, flat panel, MEMS, and other relevant industries.<br>The topics are focussed on current challenges and future needs of Advanced Process Control and Manufacturing Effectiveness.<br>The conference takes place at centers of the semiconductor and photovoltaic industry in Europe annually. </font><font face="Arial, Helvetica, sans–serif" size="–1" color="#000000">It is coordinated with the Sematech AEC/APC Symposium in America and Asia and Semicon Europe. The conference is organised by Silicon Saxony, a member of European Semiconductor Networks, and hosted locally. The conference is self–financed by fees and sponsoring.</font></p><br><p><strong><font face="Arial, Helvetica, sans–serif" size="–1">Advanced Process Control on Unit Process Level</font></strong></p> <ul><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>APC applications at Unit Processes </strong><br><font color="#333333"><strong>Plasma processes</strong> (PVD, PECVD, plasma etch, P3I), <strong>Thermal processes</strong> (CVD, e–beam, i–beam, evaporation, doping, epitaxy, diffusion, RTP), <strong>Wet processes </strong>(clean, etch, electro– and electroless plating), <strong>Metrology</strong> (films, defect density, in line and large area metrology), <strong>Lithography</strong> (track, exposure tool), <strong>Implant, CMP, Backend</strong> </font></font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Unit process control methods</strong><br></font><font face="Arial, Helvetica, sans–serif" size="–1" color="#000000">Fault detection and classification (FDC) and fault prediction (FP), Run–to–Run Control (R2R), large area uniformity, unit process development and transfer </font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Tool and sensor data analysis </strong><br><font color="#000000">Sensor implementation and integration, data collection, aggregation, classification and quality, assigning of logistical data, statistical approaches and non–statistical measures </font></font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Maintenance & tool optimization </strong><br><font color="#333333">Preventive maintenance, condition–based maintenance, predictive maintenance, tool improvements, spare parts assessment and qualification, conditioning and first wafer effects, chamber matching </font></font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Enhanced Equipment Quality Assurance (EEQA) </strong><font color="#000000">Physical and chemical unit process models and model–based sensors, methods to ensure component functionality, reliability, performance and traceability, Equipment Health Monitoring (EHM) </font></font></li></ul><br><p><font face="Arial, Helvetica, sans–serif"><strong><font size="–1">Advanced Process Control on Fab Level</font></strong></font></p> <ul><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Fab level process control methods </strong><br><font color="#000000">Run–to–Run and Wafer–to–Wafer control, realtime control, control algorithms, defect inspection, test structures (wafer), sampling strategy </font></font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Virtual metrology </strong><br><font color="#000000">Application of process models, control density improvement, reduction of measurement operations and non–product wafers, throughput increase </font></font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Yield management </strong><br><font color="#333333">Prediction and improvement of product parameters and yield by use of APC methods, novel methods of yield modeling and management </font></font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>Factory data analysis </strong><br><font color="#000000">Real–time data collection aggregation, classification and quality, process and equipment capability, mathematical methods and model creation, novel methods of data visualization and data analysis </font></font></li><li><font face="Arial, Helvetica, sans–serif" size="–1"><strong>IT infrastructure </strong><br><font color="#333333">Tool interfaces and communication, sensor / actuator bus, interfaces, demands on new standards </font></font></li></ul> <p> </p> <p> </p> <p><strong><font face="Arial, Helvetica, sans–serif" size="–1">Manufacturing Effectiveness and Productivity</font></strong></p> <ul><li><font size="–1"><font face="Arial, Helvetica, sans–serif"><strong>Unit process & equipment productivity </strong><br><font color="#333333">Throughput and uptime improvement, cycle time and variability reduction, non–productive wafer and substrate reduction, tool and unit process related productivity improvement</font> </font></font></li><li><font size="–1"><font face="Arial, Helvetica, sans–serif"><strong>Factory productivity and automation </strong><br><font color="#000000">Factory scheduling and dispatching optimization, throughput and uptime improvement, cycle time and variability reduction, automation–related productivity improvement, master data management, Material tracking of materials, spare parts and consumables, production control </font></font></font></li><li><font size="–1"><font face="Arial, Helvetica, sans–serif"><strong>Factory modeling, simulation and optimization </strong><br><font color="#000000">Design for manufacturing, future factory design, capacity and cost modeling, yield modeling & improvement, novel methods of manufacturing data analysis and visualization </font></font></font></li><li><font size="–1"><font face="Arial, Helvetica, sans–serif"><strong>Cost optimisation and end–of–life equipment issues </strong><br><font color="#000000">Fixed and variable cost reduction, Cost of Ownership (CoO) and Overall Equipment Efficiency (OEE), unit cost modelling, equipment and maintenance optimization </font></font></font></li><li><font size="–1"><font face="Arial, Helvetica, sans–serif"><strong>Environment and Green Manufacturing </strong><br><font color="#000000">Global ESH strategies, facilities operations, facility systems reliability improvements, manufacturing sustainability and resource conservation, lean manufacturing </font></font></font></li></ul>
Abbrevation
APCM
City
Grenoble
Country
France
Deadline Paper
Start Date
End Date
Abstract