<span style="font–size:11.0pt" lang="EN–GB">During the last fifteen years, this Workshop has been developed into a forum of exchange on the latest research and developments in the field of interconnect modeling, simulation and measurement at chip, board, and package level. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation.<br>The topics of the Workshop include but are not limited to:<br>Signal Integrity<br>High–Speed Interconnects and high–speed channels<br>Power Integrity/ Ground Noise<br>Power Distribution Networks<br>Electronic packages and microsystems<br>3D technologies for ICs and packages<br>RF, Microwave packaging and mixed signal systems<br>Nano–Interconnects and nano–structures<br>Electromagnetic Theory and Modeling<br>Transmission Line Theory and Modeling<br>Macro–Modeling, reduced–order models<br>Advanced Simulation Tools for Signal and Power Integrity<br>Electromagnetic Compatibility<br>Coupling Effects on Interconnects<br>Radiation & Interference<br>Testing & Interconnects<br>Time and Frequency Domain Measurement Techniques<br></span>
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SPI
City
Sorrento
Country
Italy
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