<p class="Address"><strong>3–D integration and packaging</strong> could very well be approaching an inflection point. Within the past year alone, there have been several major announcements regarding new 2.5D, 3–D and TSV manufacturing efforts. Certainly there are obstacles remaining, but the alternatives available to the industry are comparatively far more challenging. Additionally, many believe the 3–D integration approach will ultimately offer entirely new market opportunities with new systems capabilities beyond what is currently possible with 2–D manufacturing approaches. Of course, there remains a natural degree of uncertainty as companies work to secure a technology position, obtain new process and design tools, and of course, new customers and new applications. </p> <p class="Address">This conference continues to give a broad, yet thorough perspective on the techno–market opportunity and challenge offered by building devices and systems in the vertical dimension. Industry leaders from around the world are invited to speak at this conference, on a range of topics important to the emerging and on–going 3–D integration and packaging efforts. The format of the conference and its presentations enables speakers to present the most up–to–date and forthright perspectives possible. </p> <em>3–D Architectures for Semiconductor Integration and Packaging<strong> targets</strong></em> <strong><em>senior–level technologists, managers, and executives</em></strong> as speakers and attendees, from leading companies and organizations from around the world. Make plans to attend today!<br>
City
Burlingame
Country
United States
Start Date
End Date
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